Split-type Visible Light Imaging Module
Visible Light: 0.4–0.9 μm
Split-type visible light modules from 1080p to 4K (3840×2160). FPGA platform, global shutter. MIPI, CML, SDI, CameraLink options. 35×35mm board.
Split-type visible light modules from 1080p to 4K (3840×2160). FPGA platform, global shutter. MIPI, CML, SDI, CameraLink options. 35×35mm board.
| Spectral Band | Visible Light: 0.4–0.9 μm |
| Resolution Options | 1920×1080 / 2560×1440 / 3840×2160 |
| Pixel Size | 3.5 μm (V19B) / 2.5 μm (V25/V38) |
| Compatible Lenses | Fixed-focus athermalized, Continuous zoom, Motorized focus, Dual FOV |
| Video Interface | CameraLink / SDI / MIPI / CML |
| Platform | FPGA · Global Shutter |
| Communication | RS232/RS422 (V19B) / RS422 (V25/V38) |
| Power Supply | DC 12V (V19B-CL) / DC 5V (others) |
| Dimensions | 40×40 mm (V19B-CL) / 35×35 mm (others) |
1920×1080 visible light module with POE interface. Hisilicon platform, rolling shutter. RS232/RS422. DC 48V, 168×68×105mm.
A full-color 1920×1080 low-light visible/NIR module with 4 μm pixels, >100 dB HDR, SDI and PAL outputs, 30/60/90 fps modes, and ≤3 W power consumption.
A 640×512 InGaAs SWIR imaging module covering 0.9–1.7 μm with a 15 μm pixel pitch, 50 Hz Camera Link output, and global exposure from 20 μs to 19 ms.
See the module and related imaging technology in real field footage.
A practical comparison of multiple visible-light and thermal fusion modes, showing how scene detail and heat signatures can be presented together.
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A 1920×1080 visible channel demonstrates real-time AI target tracking for EO/IR payloads, vehicles, perimeter systems, and low-altitude security.
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Security Monitoring
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Smart City
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Machine Vision
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Industrial Inspection
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