Three Imaging Module Families
SPECTRA single-band thermal, FUSION dual-band, and NEXUS AI-integrated systems — every EO/IR imaging need covered under one roof.
SPECTRA Series — Single-Band Thermal
From 26×26mm compact uncooled LWIR boards to 1280-resolution cooled MWIR cores. Five interface variants: MIPI, SDI, CameraLink, BT1120, Ethernet.
FUSION Series — Dual-Band
Industry's first single-chip LWIR + visible dual-band module. 35×35mm, DC 5V, pixel-aligned IR and visible output with ultra-low latency and on-module sync.
NEXUS Series — AI Imaging System
Single-board AI imaging system with integrated NPU. Freely configurable IR + visible band combination. Ethernet/SDI output, custom algorithm deployment supported.
Precision Imaging from Core to System
Upstream module supply and deep customization for EO/IR system integrators — engineered in Wuhan's national optoelectronics hub.
Full Spectral Coverage
Visible, low-light, SWIR (0.9–1.7μm), MWIR (3–5μm), and LWIR (8–14μm) — one supplier for every band in your EO/IR system.
SWaP-Optimized Design
From 26×26mm uncooled boards to 35×35mm dual-band modules at DC 5V — purpose-built for UAV, gimbal, and soldier-worn platforms.
Universal Interface Support
SDI, CameraLink, MIPI CSI-2, BT1120, CML LVDS, Ethernet, RS422, CAN — full compatibility with global system architectures.
OEM Deep Customization
Custom interface variants, lens mounts, connector placement, NUC timing, and algorithm model integration for production programs.
Where Our Modules Perform
From airborne fire control to UAV power inspection — IRmodules imaging cores are deployed across military, security, and industrial platforms worldwide.
News & Technical Articles
Product announcements, integration guides, and application insights from the IRmodules engineering team.
How Does Infrared Module Power Consumption Affect System Design?
Infrared module power consumption affects power supply, cooling, battery life, enclosure size, startup margin, and OEM reliability.
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Power Consumption in Thermal Camera Cores
Understand power consumption in thermal camera cores, including detector type, cooling, frame rate, processing load, and OEM thermal design trade-offs.
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SWaP Considerations in Thermal Camera Modules
SWaP considerations in thermal camera modules, including detector choice, optics, power, cooling, interfaces, and OEM integration trade-offs for embedded OEMs.
Read More →Ready to Build Your EO/IR System?
Discuss your requirements with our engineers. Custom modules, interface variants, and production-scale supply — all from Wuhan's Optics Valley.
Contact IRmodules