Professional infrared and electro-optical imaging modules for EO/IR system integrators. Cooled MWIR, uncooled LWIR, SWIR, visible light, and AI multi-band solutions.
A 10 μm, 1024×768 HOT cooled MWIR imaging module with a 144 mm athermalized lens, Camera Link output, ≤40 mK NETD, and compact 200×77×62 mm packaging.
A 1280×1024, 10 μm cooled MWIR core with ≤40 mK NETD, 25 Hz Camera Link output, RS422 control, and support for fixed or continuous-zoom optical assemblies.
640×512 cooled MWIR module. AVT / SDI / CameraLink. RS422/CAN. DC 28V, 240×115×110mm. Ideal for compact cooled MWIR payloads.
1280×1024 uncooled LWIR module in a 35×35mm board. Available in four interface variants: MIPI, CameraLink, BT1120, CML. DC 12V.
A compact 640×512, 12 μm uncooled LWIR module with 50 Hz SDI output, ≤20 ms latency, RS422 control, and a 35×35×30 mm-class envelope.
640×512 polarimetric LWIR module at 7μm pixel pitch. Detects camouflaged targets and discriminates materials by polarization signature. CameraLink, 45×45mm.
1920×1080 visible light module with POE interface. Hisilicon platform, rolling shutter. RS232/RS422. DC 48V, 168×68×105mm.
A full-color 1920×1080 low-light visible/NIR module with 4 μm pixels, >100 dB HDR, SDI and PAL outputs, 30/60/90 fps modes, and ≤3 W power consumption.
A 640×512 InGaAs SWIR imaging module covering 0.9–1.7 μm with a 15 μm pixel pitch, 50 Hz Camera Link output, and global exposure from 20 μs to 19 ms.
Split-type visible light modules from 1080p to 4K (3840×2160). FPGA platform, global shutter. MIPI, CML, SDI, CameraLink options. 35×35mm board.
Single-chip dual-band fusion on a 35×35mm board. Simultaneous visible light + LWIR output with ultra-low latency and minimal power draw.
A lightweight dual-spectrum module combining 640×512 LWIR and 2560×1920 monochrome visible/NIR channels with independent 25 Hz outputs, RS422 control, and 5 V operation.
High-resolution dual-band module. Up to 1280×1024 LWIR + 2560×1440 visible. CML or MIPI. 35×35mm, DC 5V. Two detector configuration options.
Single-board multi-band systems with freely configurable IR + visible bands and integrated AI processing. Deploy custom detection and tracking algorithms on-device.
A single-board dual-channel EO/IR module combining 640×512 LWIR, 1920×1080 visible imaging, H.265 Ethernet streaming, and AI tracking above 50 Hz.
IRmodules is currently developing chip-level detector and readout IC products. Register your interest to receive updates when chip-level products become available.
Register InterestOur engineering team provides deep customization — interfaces, resolution, integration, and algorithm development tailored to your system.
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