Professional infrared and electro-optical imaging modules for EO/IR system integrators. Cooled MWIR, uncooled LWIR, SWIR, visible light, and AI multi-band solutions.
A 10 μm, 1024×768 HOT cooled MWIR imaging module with a 144 mm athermalized lens, Camera Link output, ≤40 mK NETD, and compact 200×77×62 mm packaging.
1280×1024, 10μm HgCdTe (MCT) cooled MWIR infrared module, F4.0 aperture, NETD ≤40mK, 25Hz frame rate, default F4 30~150mm continuous-zoom lens; provides SDI / CameraLink / MIPI interface configurations and RS422 control.
640×512 cooled MWIR module built on a 15 μm detector and RS058 cryocooler, NETD down to 16 mK. Pictured configuration ships with a 15–300 mm / F5.5 continuous-zoom lens; CameraLink with RAW/YUV output, further zoom options up to 32–730 mm / F4.
A 1280×1024, 12 μm uncooled LWIR module shown with the 45 mm F1.0 fixed-focus athermalized lens — 25 Hz imaging, MIPI video output, RS422 control, ≤3 W steady-state power and ≤80 g module weight.
SPECTRA L12E is a 1280×1024/12 μm uncooled LWIR network thermal imaging module with a 50 mm F1.0 athermalized fixed lens and 17.5°×14.0° FOV, delivering RTSP video over Gigabit Ethernet and RS485 Modbus RTU for long-range surveillance, perimeter protection and fire detection.
Spectra L12N is a high-performance, high-accuracy thermal imaging module for general IP networks.
Spectra L12T is an uncooled infrared module with a 1280×1024 high-resolution VOx detector, the 2nd-generation in-house Asic-ISP image processor and fused shutterless algorithms, delivering fine, clear images at up to 50 Hz (30 Hz for thermometry).
A 640×512, 12 μm uncooled LWIR module shown with the 25 mm F1.0 fixed-focus athermalized lens — 50 Hz imaging, SDI/MIPI video output, RS422 control, and a 9.1–75 mm fixed-lens series.
SPECTRA L06C is an ultra-compact uncooled LWIR module with a 640×512/12 μm VOx detector, ≤23 g weight, CVBS/USB-UVC/BT.656 video, dual-range thermometry and 4.6–75 mm athermal lens options.
Spectra L06NT is a high-accuracy infrared module for general IP networks.
Spectra L06T2 is an infrared module built on our high-refresh-rate 12 μm WLP-packaged detector and the 2nd-generation in-house Asic-ISP image processor.
640×512/12 μm uncooled infrared sensor + professional imaging readout circuitry + proprietary image processing algorithms = Spectra L06P.
Spectra L06CN is a coin-sized 640×512/12 μm uncooled LWIR core — 25.4×25.4×14.1 mm, 11.5 g, 0.8 W — with USB2.0/DVP/LVDS output and a radiometric version with ARM/Windows/Linux SDK.
Spectra L04U is an ultra-compact infrared module built around a 384×288-resolution infrared detector with a choice of optical lenses, an image processing board and a high-load-bearing mechanical structure.
SPECTRA L04C is an ultra-compact uncooled LWIR module with a 384×288/12 μm VOx detector, ≤23 g weight, CVBS/USB-UVC/BT.656 video, dual-range thermometry and 4.6–75 mm athermal lens options.
Spectra L04T is an infrared module built on our high-refresh-rate 12 μm WLP-packaged detector and the 2nd-generation in-house Asic-ISP image processor.
640×512 polarimetric LWIR module at 7μm pixel pitch. Detects camouflaged targets and discriminates materials by polarization signature. CameraLink, 45×45mm.
1920×1080 visible light module with POE interface. Hisilicon platform, rolling shutter. RS232/RS422. DC 48V, 168×68×105mm.
A full-color 1920×1080 low-light visible/NIR module with 4 μm pixels, >100 dB HDR, SDI and PAL outputs, 30/60/90 fps modes, and ≤3 W power consumption.
A 640×512 InGaAs SWIR imaging module covering 0.9–1.7 μm with a 15 μm pixel pitch, 50 Hz Camera Link output, and global exposure from 20 μs to 19 ms.
Split-type visible light modules from 1080p to 4K (3840×2160). FPGA platform, global shutter. MIPI, CML, SDI, CameraLink options. 35×35mm board.
Single-chip dual-band fusion on a 35×35mm board. Simultaneous visible light + LWIR output with ultra-low latency and minimal power draw.
A lightweight dual-spectrum module combining 640×512 LWIR and 2560×1920 monochrome visible/NIR channels with independent 25 Hz outputs, RS422 control, and 5 V operation.
High-resolution dual-band module. Up to 1280×1024 LWIR + 2560×1440 visible. CML or MIPI. 35×35mm, DC 5V. Two detector configuration options.
Single-board multi-band systems with freely configurable IR + visible bands and integrated AI processing. Deploy custom detection and tracking algorithms on-device.
A single-board dual-channel EO/IR module combining 640×512 LWIR, 1920×1080 visible imaging, H.265 Ethernet streaming, and AI tracking above 50 Hz.
IRmodules is currently developing chip-level detector and readout IC products. Register your interest to receive updates when chip-level products become available.
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